Organizations

Legislation RoHS/
WEEE/EU Directive

Companies

 

SMART Group
IPC Pb-Free Info
SolderTec
CALCE Pb-Free Info Center
NEMI Pb-Free Initiatives
NIST Pb-Free Properties Database
NPL Pb-Free News & Info
Indium Corporation

 
 

Available Lead-Free Solder Alloys

Indium Corporation offers custom alloy development for specific temperature requirements and for special metallizations as well as non-metal bonding applications. Indium Corporation has been developing lead-free and cadmium-free alloys for many years. We have over 25 standard alloys, including our three patented alloys (see notes below). Or we can develop an alloy for your specific application.

If you would like to evaluate several of these alloys, consider our Wire Selector Kit, which offers many choices without cadmium or lead.
   
  Low Temperature Solders
Indalloy No. Composition Solidus
(oC.)

Liquidus
(oC.)

 U.S. Patent Comments
19
51In / 32.5Bi / 16.5Sn
60
(eutectic)
Lowest melting point alloy; uncommon applications.
162
66.3In / 33Bi
72
(eutectic)
Poor wetting.
174
57Bi / 26In / 17Sn
79
(eutectic)
Marginal wetting.
27
54.02Bi / 29.68In / 16.3Sn
81
(eutectic)
Marginal wetting.
1E
52In / 48Sn
118
(eutectic)
Lowest melting point solder with good wetting.
281
58Bi / 42Sn
138
(eutectic)
Good thermal fatigue performance; established history.
   
  Mid-Range Temperature Solders
Indalloy No. Composition Solidus (oC.) Liquidus (oC.) U.S. Patent Comments
231 86.5Sn / 5.5Zn / 4.5In / 3.5Bi 174 186 5,455,0043 Zn causes high drossing; corrosion concerns; not available as paste.
226 83.6Sn / 8.8In / 7.6Zn 181 187 5,242,6583 Zn causes high drossing; corrosion concerns; not available as paste.
227 77.2Sn / 20.0In / 2.8Ag 175 187 5,256,3703 & 5,580,5203 Not for use over 100oC due to 118oC Sn / In eutectic; cost.
254 86.9Sn / 10.0In / 3.1Ag 204 205 Lower indium mitigates Sn / In eutectic problem.
201 91Sn / 9Zn 199 (eutectic) Zn causes high drossing, not available as paste.
   
  Higher Temperature Solders
Indalloy No. Composition Solidus (oC.) Liquidus (oC.) U.S. Patent Comments
2411 95.5Sn / 3.8Ag / 0.7Cu 217 220 Popular SAC alloy for SMT assembly.
246 95.5Sn / 4.0Ag / 0.5Cu 217 225 Petzow (German) prior art reference makes this alloy patent-free.
2521 95.5Sn / 3.9Ag / 0.6Cu 217 225 NEMI promoted alloy
2561 96.5Sn / 3.0Ag / 0.5Cu 217 220 Reduced silver SAC alloy.
232 93.6Sn / 4.7Ag / 1.7Cu 217 244 5,527,6284 Original Iowa State Ames Lab SAC alloy.
249 91.8Sn / 3.4Ag / 4.8Bi 211 213 5,439,6394 Board & component metallizations must be completely Pb-free.
121 96.5Sn / 3.5Ag 221 (eutectic) Simple binary alloy solder has history of use; marginal wetting.
2442 99.3Sn / 0.7Cu 227 (eutectic) Inexpensive, popular use in wave soldering.
129 99Sn / 1Sb 232 235 Antimony addition increase strength.
131 97Sn / 3Sb 232 238 Antimony addition increase strength.
133 95Sn / 5Sb 235 240 Antimony addition increase strength.
209 65Sn / 25Ag / 10Sb 233 (melting point) Motorola-developed “J-alloy” die attach solder; very brittle.
   
  High Temperature Solders
Indalloy No. Composition Solidus
(oC.)		 Liquidus
(oC.)		 U.S. Patent Comments
182 80Au / 20Sn 280 (eutectic) Highest temperature Pb-free.
   
 
  • 1Alloys of choice for general SMT assembly
  • 2Alloy of choice for general wave solder assembly
  • 3ICA Patented Alloy
  • 4ICA Licensed Patent
   
 

 

• Europe Regulations
• China Regulations
• Japan Regulations
 

news courtesy of emsnow.com

Registration now open for SMTA International 2008
May 16, 2008 - Early bird registration rates are applicable through July 11th.
Automotive Infotainment Technology shifts upscale in 2008
May 16, 2008 - The year 2008 is expected to be an exciting period for the global automotive infotainment systems market, as car makers and their suppliers focus on more advanced electronics to lure customers, according to iSuppli Corp.
BenQ targets BRIC to drive sales
May 16, 2008 - After stinging losses from its failed Siemens mobile phone venture, BenQ is concentrating on its original strengths: providing LCD projectors and monitors
Automotive Infotainment Technology Shifts Upscale in 2008
May 15, 2008 - The year 2008 is expected to be an exciting period for the global automotive infotainment systems market, as car makers and their suppliers focus on more advanced electronics to lure customers, according to iSuppli Corp.
 
 
home home